59-THERMAL PAD KIT
This federal contract opportunity closed on February 17, 2026. The deadline for submissions has passed.
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This opportunity has closed
Response deadline was February 17, 2026
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View all similar opportunitiesKey Takeaways
- This opportunity has closed - response deadline has passed
- Full and open competition - all businesses eligible to bid
- Work to be performed in COLUMBUS, OH
- Industry: Semiconductor and Related Device Manufacturing
Contract Details
- Notice ID
- SPE7M526T7098
- Opportunity Type
- Combined Synopsis/Solicitation
- Agency
- DEPT OF DEFENSE
- Sub-Agency
- DEFENSE LOGISTICS AGENCY
- Office
- DLA LAND AND MARITIME
- Posted Date
- Friday, February 6, 2026
- Response Deadline
- Tuesday, February 17, 2026
- PSC Code
- 59
- Set-Aside
- Full & Open Competition
- Place of Performance
- COLUMBUS, OH, 43218-3990
- Status
- Active
Description
Proposed procurement for NSN 5999015337681 THERMAL PAD KIT: Line 0001 Qty 113 UI EA Deliver To: W1A8 DLA DIST SAN JOAQUIN By: 0167 DAYS ADO Approved source is 93346 802064303100-1. The solicitation is an RFQ and will be available at the link provided in this notice. Hard copies of this solicitation are not available. Specifications, plans, or drawings are not available. All responsible sources may submit a quote which, if timely received, shall be considered. Quotes must be submitted electronically.
Why This Opportunity Matters
The Department of DEFENSE is actively seeking qualified contractors for semiconductor and related device manufacturing in COLUMBUS, OH.
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