Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies
Key Takeaways
- Full and open competition - all businesses eligible to bid
- Industry: Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
Contract Details
- Notice ID
- W52P1J26R0001
- Opportunity Type
- Special Notice
- Agency
- DEPT OF DEFENSE
- Sub-Agency
- DEPT OF THE ARMY
- Office
- DEPT OF THE ARMY
- Posted Date
- Tuesday, August 18, 2026
- Response Deadline
- Wednesday, September 16, 2026
- PSC Code
- R425
- Set-Aside
- Full & Open Competition
- Place of Performance
- Not specified
- Status
- Active
Description
Information Requested: The U.S. Army Combat Capabilities Development Command Aviation and Missile Center (DEVCOM AvMC), Redstone Arsenal, AL is conducting market research to identify domestic products, suppliers, designers and manufacturers of advanced protection architectures, systems, components, and other technologies for packaged microelectronics intended for deployment into current and future military systems of interest to the Department of Defense (DoD). This RFI is seeking information from suitable vendors/vendor teams related to the following Technology Areas: 1. Board-level Security: Capabilities spanning microelectronic components and portable soft IP integrated with commercial-off-the-shelf (COTS) devices across modular open systems architectures (MOSA) form factor systems (e.g
Why This Opportunity Matters
The Department of DEFENSE is seeking responses for research and development in the physical, engineering, and life sciences (except nanotechnology and biotechnology).
Similar Opportunities
Browse Related
Looking for more opportunities?
Browse our full directory of government contracts
