Semiconductor Die Bonding and Vacuum Packaging System
Award NoticeAwarded
This federal contract opportunity has been awarded to on September 14, 2026.
Award Information
DEPT OF DEFENSE awarded this contract to for $672,985 on September 14, 2026, as part of federal procurement initiatives.
This award is part of federal acquisition procurement activities.
- Award Number
- N0017326P2436
- Award Amount
- $672,985
- Award Date
- September 14, 2026
Key Takeaways
- No response deadline specified - contact the agency for details
- Full and open competition - all businesses eligible to bid
- Work to be performed in WASHINGTON, DC
- Industry: Packaging Machinery Manufacturing
Contract Details
- Notice ID
- N0017326P2436
- Opportunity Type
- Award Notice
- Agency
- DEPT OF DEFENSE
- Sub-Agency
- DEPT OF THE NAVY
- Office
- NAVAL RESEARCH LABORATORY
- Posted Date
- Wednesday, September 16, 2026
- Response Deadline
- Not specified
- PSC Code
- 3540
- Set-Aside
- Full & Open Competition
- Place of Performance
- WASHINGTON, DC, 20375-5328
- Status
- Active
Description
This contract is awarded to COOK AND WEIL, INC. under simplified procedures for certain commercial items included in FAR subpart 13.5 for Semiconductor Die Bonding and Vaccuum Packaging System.
Why This Opportunity Matters
The Department of DEFENSE is seeking responses for packaging machinery manufacturing in WASHINGTON, DC.
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